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Dongguan Precision Test Equipment Co., Ltd.
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High Low Temperature Air Pressure Testing Equipment For Electronics Industry

Dongguan Precision Test Equipment Co., Ltd.
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High Low Temperature Air Pressure Testing Equipment For Electronics Industry

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Brand Name : PRECISION

Model Number : RTH-270

Certification : ISO

Place of Origin : CHINA

MOQ : 1

Price : $6000

Payment Terms : T/T

Supply Ability : 100/month

Delivery Time : 15 working days

Packaging Details : Standard export packaging

Customized support : OEM ODM

Origin : China

Material : Stainless Steel

Controller : Programmable LCD Touch Screen

Temp accuracy : 0.5°C

Temp uniformity : 0.5°C

Refrigerant : Environmental friendly R23/R404

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Fast Delivery High-Low Temperature Air Pressure Testing Equipment for Electronics Industry

In the fast-paced and highly competitive electronics industry, the reliability and durability of products are non-negotiable. The Customized High-Low Temperature Air Pressure Testing Equipment emerges as a vital asset, specifically designed to meet the unique and stringent requirements of this sector.

1. Product Name and Purpose

This customized testing equipment is engineered to expose electronic components, devices, and systems to a comprehensive range of extreme high and low temperatures, combined with variable air pressure conditions. It plays a crucial role in electronics manufacturing, research and development, and quality control. By replicating the diverse and often harsh environmental scenarios that electronics may encounter during their lifecycle, from the thin air and temperature fluctuations of high-altitude flights to the humid and pressurized conditions in industrial settings, it enables manufacturers and engineers to assess the performance, functionality, and integrity of their products. This is essential for identifying potential weaknesses and making informed design and manufacturing improvements, ensuring that electronic devices can operate flawlessly and withstand the rigors of real-world applications.

2. Product Features

  • Durable and Insulated Chamber Design
    • The testing chamber is constructed with high-strength, corrosion-resistant materials to endure the stresses of continuous temperature and pressure cycling. The walls are composed of multiple layers of advanced insulation, providing exceptional thermal and pressure isolation. This insulation not only guarantees precise temperature and pressure control but also safeguards against external environmental interference, maintaining a stable and consistent testing environment. The interior surface is smooth and non-conductive, preventing any electrostatic discharge or chemical reactions that could damage the sensitive electronic samples.
    • The chamber door is equipped with a high-precision sealing mechanism, ensuring airtightness even under significant pressure differentials. It is engineered for effortless operation, allowing for convenient loading and unloading of various electronic components and assemblies. The overall structure is built to withstand the mechanical forces associated with rapid temperature and pressure changes, safeguarding the integrity of the equipment and the samples within.
  • Advanced Temperature and Pressure Control Systems
    • The temperature control system is a marvel of modern engineering, capable of achieving an extensive temperature range. It can plummet to as low as -70°C, simulating the frigid conditions of polar regions or high-altitude environments, and soar up to +120°C, replicating the heat generated in confined electronic enclosures or desert-like operating conditions. The temperature can be adjusted with an accuracy of ±0.3°C, enabling precise and repeatable testing.
    • The air pressure control system is equally sophisticated. It can create a wide range of pressure conditions, from near-vacuum levels comparable to outer space to several atmospheres, mimicking deep-sea or high-pressure industrial environments. The pressure control precision is within ±0.05 kPa, ensuring accurate and reliable testing scenarios. The system also offers programmable pressure profiles, allowing for the simulation of complex environmental changes, such as the rapid depressurization and repressurization experienced during air travel.
  • Precision Instrumentation and Data Acquisition
    • The equipment is outfitted with a suite of state-of-the-art sensors. Temperature sensors are strategically positioned throughout the chamber to monitor any temperature gradients and ensure uniform thermal exposure. Pressure sensors provide real-time data on the internal air pressure, while additional sensors can be incorporated to measure other parameters such as humidity or gas composition, depending on the specific testing requirements. These sensors are connected to a cutting-edge data acquisition system that records and stores all the measured variables in real-time. The data can be accessed and analyzed instantly or retrieved later for in-depth studies and compliance reporting.
    • The control panel of the equipment is intuitively designed, enabling operators to effortlessly program and execute complex test sequences. It allows for the precise setting of temperature, pressure, and other parameters, as well as the customization of test durations and cycling patterns. The panel displays all the essential information, including current temperature, pressure, and the status of the control systems, and features built-in alarms and safety mechanisms to alert operators in case of any abnormal conditions or system malfunctions.

3. Specific Parameters

  • Model JTC-80 JTC-150 JTC-225 JTC-408 JTC-800 JTC-1000
    Inside dimension(W x D x H) mm 40 x 50 x40 50 x 60 x 50 50 x 75 x 60 60 x 85 x 80 100 x 100 x 80 100 x 100 x 100
    Outside dimension(W x D x H) mm 95 x 140 x 95 105 x 150 x 105 105 x 165 x 115 115 x 175 x 140 155 x 190 x 140 155 x 190 x 160
    Internal material #304 Stainless Steel
    External material Powder coated #304 Stainless Steel
    Temperature range + 150℃~ - 70 ℃
    Humidity range 10% ~ 98% R. H
    Temperature Uniformity ℃ 0.01
    Humidity Uniformity % R. H. 0.1
    Temperature stability ℃ ±0.3
    Humidity stability % R. H. ±2
    High temperature ℃ 100 100 100 100 100 100
    Heating time (min) 20 30 30 30 30 30
    Low temperature 0, -40, -70 0, -40, -70 0, -40, -70 0, -40, -70 0, -40, -70 0, -40, -70
    Cooling time (min) 20, 50, 70 20, 50, 70 20, 50, 70 20, 50, 70 20, 50, 70 20, 50, 70
    Air circulation system Mechanical convection system
    Cooling system Imported compressor, fin evaporator, gas condenser
    Heating system Sus304 Stainless steel High-speed heater
    Humidification system Steam Generator
    Humidification water supply Reservoir, Sensor-controller solenoid valve, recovery-recycle system
    Controller Touch panel
    Electrical power requirements Please contact us for requirements of specific models
    Accessories Multi-layer enhanced glass window,test hole, action indicator light, case lighting barrier shelf x2
    Safety device Circuit system load protection, compressor load protection, control system load protection, humidifier load protection, overtemperature load protection, fault warning light

4. Product Functions

  • Accurate Environmental Replication for Electronic Devices
    • The primary function of this customized testing equipment is to faithfully reproduce the complex and demanding environmental conditions that electronic products face. By precisely controlling temperature and air pressure, it allows manufacturers to evaluate how their products will behave in various real-world situations. For instance, testing a smartphone's display under high-altitude low-pressure and cold temperature conditions can reveal any issues with image quality, touch responsiveness, or even structural integrity. This information can then be used to optimize the display design, select more suitable materials, or improve the device's thermal and pressure management systems, enhancing its overall reliability and user experience.
    • The ability to conduct cyclic temperature and pressure tests is a powerful feature. This involves subjecting electronic samples to repeated and alternating temperature and pressure changes, which can uncover latent defects or weaknesses that might not be apparent under static conditions. For example, a printed circuit board may appear to function normally at a single temperature and pressure but develop cracks or solder joint failures after several cycles of extreme temperature and pressure variation. The testing equipment can detect such issues early in the product development cycle, enabling manufacturers to make corrective actions and avoid costly recalls or field failures.
  • Ensuring Compliance with Electronics Industry Standards
    • The electronics industry is governed by a multitude of strict standards and regulations regarding product quality and environmental testing. The Customized High-Low Temperature Air Pressure Testing Equipment is a reliable tool for ensuring compliance. For example, many electronic components and devices need to meet specific temperature and pressure performance requirements set by organizations like the International Electrotechnical Commission (IEC) or industry-specific associations. By using this equipment to conduct tests in accordance with these standards, manufacturers can prove that their products are fit for purpose and gain market access.
    • Regulatory bodies rely on accurate test results obtained from such equipment to enforce safety and quality regulations. It serves as a means for inspectors to determine whether electronic products can withstand the environmental stresses they may encounter during their intended use, thereby protecting consumers and maintaining the integrity of the electronics market.
  • Driving Innovation in Electronics Research and Development
    • In the field of electronics research and development, this testing equipment is an invaluable resource. It allows engineers and scientists to explore the boundaries of new materials and technologies. For example, in the development of next-generation flexible electronics, understanding how the materials and circuitry perform under different temperature and pressure conditions is crucial. The equipment can be used to test and optimize the performance of flexible substrates, conductive inks, and thin-film transistors, leading to the creation of more durable and reliable flexible electronic devices.
    • The detailed data provided by the testing equipment also fuels innovation in areas such as miniaturization and high-power electronics. For instance, in the design of high-density integrated circuits, knowledge of how temperature and pressure affect the performance and reliability of the tiny components and interconnects can help engineers develop more efficient cooling and packaging solutions, enabling further miniaturization and increased performance.

5. Production and Quality Assurance

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